Процессор Intel Celeron Dual Core T3100

Результаты тестов
SuperPI 1M	29.8
SuperPI 2M	71.0
3DMark06	1687

Рейтинг	3Dmark06
295. Intel Core i3-2367M	1689
294. Intel Core i5-470UM	1689
296. Intel Celeron Dual Core T3100	1687
297. AMD A4-4300M	1684
298. AMD Athlon II P320	1674
Рейтинг всех мобильных процессоров

Intel Celeron T3100 или Celeron Dual-Core T3100 — процессор начального уровня с двумя ядрами, предназначенный для ноутбуков. Он основан на 45 нм ядре Penryn, но имеет лишь 1 Мб кэш-памяти второго уровня и многие функции ядра в нем не доступны. Осталась лишь поддержка 64-битных приложений и функция Execute Disable Bit.

Аппаратные средства виртуализации, Intel Enhanced Speedstep и другие энергосберегающие технологии в этом процессоре отсутствуют, вследствие чего уровень потребления электроэнергии у Intel Celeron T3100 выше, чем у аналогичных процессоров серий Core 2 Duo или Pentium.

Производительность, которую обеспечивает T3100, подходит только для малотребовательных задач, таких как Office, веб-серфинг, обработка фото и видео базовыми программами. А вот игры и другие «тяжелые» приложения для T3100 являются проблемой, иногда его возможностей будет крайне мало.

Intel® Celeron® Processor T3100

Specifications

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Essentials

• Product Collection Legacy Intel® Celeron® Processor
• Code Name Products formerly Penryn
• Vertical Segment Mobile
• Processor Number T3100
• Off Roadmap No
• Publication Date Sunday, June 28, 2009
• Product Images View now
• Status Discontinued
• Launch Date Q3’08
• Lithography 45 nm
• Use Conditions PC/Client/Tablet
• Advocated for New Designs No

Performance Specifications

• # of Cores 2
• # of Threads 2
• Processor Base Frequency 1.90 GHz
• Cache 1 MB L2 Cache
• Bus Speed 800 MHz
• FSB Parity No
• TDP 35 W
• VID Voltage Range 1.00V-1.250V

Supplemental Information

Package Specifications

• Sockets Supported PGA478, BGA479
• T_CASE 105°C
• Package Size 35mm
• Processing Die Size 107 mm 2
• # of Processing Die Transistors 410 million
• Low Halogen Options Available Yes

Advanced Technologies

• Intel® Turbo Boost Technology ‡ No
• Intel® Hyper-Threading Technology ‡ No
• Intel® Virtualization Technology (VT-x) ‡ No
• Intel® 64 ‡ Yes
• Instruction Set 64-bit
• Enhanced Intel SpeedStep® Technology No
• Intel® Demand Based Switching No

Security & Reliability

Ordering and Compliance

Retired and discontinued

Intel® Celeron® Processor T3100 (1M Cache, 1.90 GHz, 800 MHz FSB) uFCBGA8, Tray

• MM# 902843
• Spec Code SLGVS
• Ordering Code AV80577NG0371M
• Shipping Media TRAY
• Stepping R0

Intel® Celeron® Processor T3100 (1M Cache, 1.90 GHz, 800 MHz FSB) uFCPGA8, Tray

• MM# 899865
• Spec Code SLGEY
• Ordering Code AW80577GG0371ML
• Shipping Media TRAY
• Stepping R0

Trade compliance information

• ECCN 3A991.A.1
• CCATS NA
• US HTS 8542310001

PCN/MDDS Information

SLGEY

SLGVS

Product Images

Product Images

Compatible Products

Intel® 4 Series Chipsets

Drivers and Software

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Technical Documentation

Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

T_CASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology ‡

Intel® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology ‡

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64 ‡

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

More support options for Intel® Celeron® Processor T3100 (1M Cache, 1.90 GHz, 800 MHz FSB)

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Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.

Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.

Intel technologies may require enabled hardware, software or service activation. // No product or component can be absolutely secure. // Your costs and results may vary. // Performance varies by use, configuration and other factors. // See our complete legal Notices and Disclaimers. // Intel is committed to respecting human rights and avoiding complicity in human rights abuses. See Intel’s Global Human Rights Principles. Intel’s products and software are intended only to be used in applications that do not cause or contribute to a violation of an internationally recognized human right.