Downloads for Intel® Core™ Duo Processor T2700 (2M Cache, 2.33 GHz, 667 MHz FSB)

Description	Type	OS	Version	Date
Intel® Processor Identification Utility — Windows* Version

This download installs version 6.6.15.0316 of the Intel® Processor Identification Utility for Windows*.

Software Windows 10*
Windows 8.1*
Windows 8*
6 more 6.6.15.0316
Latest 3/22/2021 Intel® Computing Improvement Program

Intel wants to empower you by providing the best computing experience. This program uses information about your computer’s performance to make product improvements in the future. (2.4.6492)

Software Windows 10*
Windows 8.1*
Windows 8* 2.4.6522
Latest 12/30/2020

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Intel® Core™ Duo Processor T2700

Specifications

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Essentials

• Product Collection Legacy Intel® Core™ Processors
• Code Name Products formerly Yonah
• Vertical Segment Mobile
• Processor Number T2700
• Status Discontinued
• Lithography 65 nm

Performance Specifications

• # of Cores 2
• # of Threads 2
• Processor Base Frequency 2.33 GHz
• Cache 2 MB L2 Cache
• Bus Speed 667 MHz
• FSB Parity No
• TDP 31 W
• Scenario Design Power (SDP) 0 W
• VID Voltage Range 1.1625V — 1.30V

Supplemental Information

Memory Specifications

Package Specifications

• Sockets Supported PPGA478, PBGA479
• T_JUNCTION 100°C
• Package Size 35mm x 35mm
• Processing Die Size 90 mm 2
• # of Processing Die Transistors 151 million

Advanced Technologies

• Intel® Turbo Boost Technology ‡ No
• Intel® Hyper-Threading Technology ‡ No
• Intel® Virtualization Technology (VT-x) ‡ Yes
• Intel® 64 ‡ No
• Instruction Set 32-bit
• Idle States No
• Enhanced Intel SpeedStep® Technology Yes
• Intel® Demand Based Switching No

Security & Reliability

Ordering and Compliance

Retired and discontinued

Intel® Core™ Duo Processor T2700 (2M Cache, 2.33 GHz, 667 MHz FSB) uFCBGA Pb-Free SLI, Tray

• MM# 882802
• Spec Code SL9K4
• Ordering Code LE80539GF0532MX
• Shipping Media TRAY
• Stepping D0

Boxed Intel® Core™ Duo Processor T2700 (2M Cache, 2.33 GHz, 667 MHz FSB) uFCPGA

• MM# 882980
• Spec Code SL9JP
• Ordering Code BX80539T2700
• Shipping Media BOX
• Stepping D0

Intel® Core™ Duo Processor T2700 (2M Cache, 2.33 GHz, 667 MHz FSB) uFCPGA, Tray

• MM# 882787
• Spec Code SL9JP
• Ordering Code LF80539GF0532MX
• Shipping Media TRAY
• Stepping D0

Trade compliance information

• ECCN 3A991.A.1
• CCATS NA
• US HTS 8542310001

PCN/MDDS Information

SL9JP

SL9K4

Product Images

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Technical Documentation

Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Scenario Design Power (SDP)

Scenario Design Power (SDP) is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage. Reference product technical documentation for full power specifications.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

T_JUNCTION

Junction Temperature is the maximum temperature allowed at the processor die.

Intel® Turbo Boost Technology ‡

Intel® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology ‡

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64 ‡

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

More support options for Intel® Core™ Duo Processor T2700 (2M Cache, 2.33 GHz, 667 MHz FSB)

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Our goal is to make the ARK family of tools a valuable resource for you. Please submit your comments, questions, or suggestions here. You will receive a reply within 2 business days.

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Your personal information will be used to respond to this inquiry only. Your name and email address will not be added to any mailing list, and you will not receive email from Intel Corporation unless requested. Clicking ‘Submit’ confirms your acceptance of the Intel Terms of Use and understanding of the Intel Privacy Policy.

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided «as-is» and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.

Intel technologies may require enabled hardware, software or service activation. // No product or component can be absolutely secure. // Your costs and results may vary. // Performance varies by use, configuration and other factors. // See our complete legal Notices and Disclaimers. // Intel is committed to respecting human rights and avoiding complicity in human rights abuses. See Intel’s Global Human Rights Principles. Intel’s products and software are intended only to be used in applications that do not cause or contribute to a violation of an internationally recognized human right.